Method and system of cooling components of a computer system

ABSTRACT

An example cooling system for a computer includes a canister that holds a compressed fluid and a gas cooling device having an inlet port and a chilled gas outlet port. In addition, the cooling system includes a valve that couples between the canister and the inlet port of the gas cooling device, the valve selectively couples the compressed fluid to the inlet port. Further, the cooling system includes a pressure regulator that coupled between the canister and the inlet port of the gas cooling device, wherein the pressure regulator selectively regulates the flow rate of gas to the inlet port of the gas cooling device. Still further, the cooling system includes a chilled gas duct system that couples to the chilled gas outlet port, the chilled duct system configured to direct the chilled gas to be incident upon at least one heat generating element of the computer system.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.11/625,956 filed Jan. 23, 2007, and titled “Method And System Of CoolingComponents Of A Computer System,” which is hereby incorporated herein byreference in its entirety for all purposes.

BACKGROUND

Computer systems are used in a diverse array of applications, forexample from simple word processing to highly complex three dimensionalgaming. With respect to gaming, increased computer system performancetranslates to more realistic game play. Computer systems used for gamingpurposes have, in most cases, high-end main processors and videographics cards which require large cooling apparatuses. Sometimescomputer systems used for gaming are modified to increase performance,such as clocking the main system processor faster than specified for theparticular processor (known as “over-clocking”).

In order to cool computer system components, particularly over-clockedprocessors, several after-market cooling systems are available, such asoversized heat sinks, high volume cooling fans, heat pipes (closed loopevaporative cooling) and water cooling systems. However, during times ofpeak processor utilization, additional cooling may be needed,particularly in computer systems using only cooling fans with heat sinksand/or heat pipes for cooling of computer system components.

BRIEF DESCRIPTION OF THE DRAWINGS

For a detailed description of exemplary embodiments of the invention,reference will now be made to the accompanying drawings in which:

FIG. 1 shows a computer system in accordance with at least someembodiments;

FIG. 2 shows a fluid schematic of a cooling system in accordance withvarious embodiments;

FIG. 3 shows a fluid schematic of a cooling system in accordance withalternative embodiments; and

FIG. 4 shows a method in accordance with embodiments of the invention.

NOTATION AND NOMENCLATURE

Certain terms are used throughout the following description and claimsto refer to particular system components. As one skilled in the art willappreciate, computer companies may refer to a component by differentnames. This document does not intend to distinguish between componentsthat differ in name but not function.

In the following discussion and in the claims, the terms “including” and“comprising” are used in an open-ended fashion, and thus should beinterpreted to mean “including, but not limited to . . . .” Also, theterm “couple” or “couples” is intended to mean either an indirect ordirect connection. Thus, if a first device couples to a second device,that connection may be through a direct connection, or through anindirect connection via other devices and connections.

DETAILED DESCRIPTION

The following discussion is directed to various embodiments of theinvention. Although one or more of these embodiments may be preferred,the embodiments disclosed should not be interpreted, or otherwise used,as limiting the scope of the disclosure. In addition, one skilled in theart will understand that the following description has broadapplication, and the discussion of any embodiment is meant only to beexemplary of that embodiment, and not intended to intimate that thescope of the disclosure is limited to that embodiment.

FIG. 1 illustrates a computer system 100 in accordance with at leastsome embodiments. In particular, computer system 100 comprises akeyboard 10 and monitor 12 coupled to the various computer systemcomponents within a case or enclosure 14 (shown in perspective cutawayview). Within the enclosure 14 resides the motherboard 16 to whichvarious heat generating components attach. For example, a processor 18,which executes instructions and generates heat, couples to themotherboard 16. In some embodiments the processor is the main systemprocessor, and in alternative embodiments the processor 18 is theprocessor on a video graphics card.

In order to help dissipate heat generated by the processor 18, a heatsink 20 is thermally coupled to the processor 18. In some embodimentsthe heat sink 20 is purely passive, conducting heat away from theprocessor 19 by way of metallic cooling fins. In other embodiments, themetallic cooling fins are combined with an integrally mounted coolingfan, which cooling fan forces airflow across the cooling fins. In yetstill other embodiments, the heat sink 20 may be a “heat pipe” whichuses a combination of conductive heat transfer and convective heattransfer (via a gas within a closed loop evaporative cooling system).

Regardless of the precise nature of the heat sink 20, during operationof the computer system 100 there may be periods of time when theprocessor 18 generates more heat than can be transferred away ordissipated by the heat sink 20, such as when the processor is beingover-clocked during aggressive game play. In order to provide additionalcooling, and in accordance with embodiments of the invention, thecomputer system 100 also comprises a burst-type cooling system to aidthe primary heat dissipation element for short periods of time (e.g.,during critical portions of game play where processor 18 temperaturerises quickly).

Still referring to FIG. 1, the burst-type cooling system comprises abottle or canister 22 coupled the enclosure 14, and in this illustrativecase the canister 22 coupled to an exterior portion of the enclosure 14.In alternative embodiments the canister may reside within the enclosure14. The contents of the canister 22, being a compressed fluid, areselectively fluidly coupled to a gas cooling device 24. The gas coolingdevice 24 is illustratively shown to couple within the enclosure 14, butin alternative embodiments resides external of the enclosure 14. In yetstill further embodiments, the gas cooling device 14 may be integralwith the canister 22. As the name implies the gas cooling device 24, byone of various mechanism described below, creates chilled gas. Thechilled gas created by the gas cooling device 24 is directed upon theheat generating component which needs additional cooling. For example, aduct system 26 may convey chilled air from a chilled air outlet to theillustrative processor 18 and/or heat sink 20.

FIG. 2 illustrates a fluid schematic of the burst-type cooling system 30in accordance with at least some embodiments. In particular, the bursttype cooling system 30 comprises the canister 22 whose compressed fluidcontents are selectively fluidly coupled to the gas cooling device 24,here being an illustrative Ranque-Hilsh vortex tube (hereinafter justvortex tube). For a vortex tube, the compressed fluid enterstangentially into a swirl chamber creating a gas swirl at high speed.Cooling takes place in a vortex tube by the splitting of the gas thatenters into two streams, with a first stream transferring kinetic energyto a second stream, resulting in separate hot and chilled gas streams.The chilled gas stream exits the vortex cooler 32 by way of a chilledair outlet 34. Vortex tubes are readily available, such as from AirTXInternational of Cincinnati, Ohio.

Still referring to FIG. 2, the chilled gas exiting the chilled gasoutlet 34 is directed upon one or more heat generating components. Insome embodiments, the vortex tube 32 is positioned proximate to the heatgenerating component, and thus the chilled gas is directed to the heatgenerating component by the vortex tube itself. Other embodiments use aduct system 36 to convey the chilled gas to the heat generatingcomponent, and in some cases divide the chilled gas between a pluralityof heat generating components.

In embodiments where the vortex tube 32 itself directs the chilled gason the heat generating components, the vortex tube 32 is mounted atleast partially within the enclosure 14 (FIG. 1). In the embodimentswhere the vortex tube 32 is mounted at least partially within enclosure,the hot gas outlet may protrude from the enclosure, or the hot gas maybe released external of the enclosure 14 by way of a duct system. Inembodiments where the chilled gas of the vortex tube 32 is conveyed byway of duct system 36, the vortex tube 32 may be at any suitablelocation internal or external of the enclosure 14.

With respect to embodiments where the gas cooling device 24 is a vortextube 32, the compressed fluid in the canister may take many forms. Insome embodiments using a vortex tube 32 the compressed fluid iscompressed air. In other embodiments using a vortex tube 32 thecompressed fluid is carbon dioxide, which in compressed form may beliquid. However, any suitable compressed fluid which experiences coolingin a vortex tube may be equivalently used. Moreover, compressed fluidsthat leave little or no residue, are non-flammable and non-conductiveprovide better performance and safety.

Still referring to FIG. 2, in order to control the selective coupling ofthe compressed fluid in the canister 22 to the gas cooling device 24, avalve 38 is used. In some embodiments, selective coupling of thecompressed fluid in the canister 22 may be accomplished manually by theuser monitoring a temperature of interest. Referring briefly to FIG. 1,the motherboard manufacturer, or the enclosure manufacture, may providea temperature sensitive element 28 (e.g., thermocouple or resistivethermal device (RTD)) which is placed proximate to the heat generatingcomponent. The temperature sensed by the temperature sensitive elementmay be displayed via software mechanisms on the monitor 12, or may bedisplayed on a front panel display 29. Regardless of the precisemechanism by which the user determines the temperature of interest, whenthe temperature reaches a predetermined threshold, the user may triggerflow of compressed fluid from the canister 22 to the cooling device 24,such as by manually triggering the valve 38.

In alternative embodiments, the valve 38 is a solenoid operated valvecontrolled by software executing in the computer system. In particular,in the embodiments shown in FIG. 1, the temperature sensitive element 28is electrically coupled to the motherboard 16, and thus the processor18. A program executing on a processor of the computer system monitorsthe temperature, and when the temperature meets or exceeds apredetermined threshold, the software triggers a output signal (e.g.,from a general purpose output port of bridge device), which in turnactuates the solenoid of valve 38.

The pressure of the compressed fluid in the canister 22 may vary, notonly by the type of compressed fluid, but also by the amount ofcompressed fluid remaining in the canister 22. In some embodiments theflow of compressed fluid from the canister to the gas cooling device 24is not controlled (other than in an on/off sense). Thus, when canisterpressure is high, more compressed fluid may flow than when the canisteris almost empty. In alternative embodiments, flow of the compressedfluid from the canister 22 to the gas cooling device 24 is controlled,such as a by a pressure regulator 42. The pressure regulator 42 controlspressure downstream of the regulator to a setpoint pressure, and as suchthe flow of gas through the gas cooling device 24 is somewhatindependent of the pressure of compressed fluid in the canister 22.

FIG. 3 illustrates embodiments of an alternative burst-type coolingsystem 50 using a gas expansion orifice 52 (shown in elevationalcross-sectional form) as the gas cooling device 24. In particular, theillustrative burst-type cooling system 50 comprises an integral canisterand pressure regulator 54. In some embodiments, the pressure regulatorand canister are selectively separable, and in other embodiments theregulator is permanently affixed to the canister. While the integralcanister and pressure regulator 54 are illustrated with respect to thegas expansion orifice embodiments, the integral canister and pressureregulator may be equivalently used with the vortex tube embodiments.

The compressed fluid within the canister is selectively fluidly coupledto the gas expansion orifice 52 by way of a valve, in these embodimentsthe valve illustrated as a solenoid operated valve 56. Providing powerto the solenoid to trigger compressed fluid flow may be accomplishedeither manually by the user monitoring a temperature, or electronicallyby software monitoring a temperature. Compressed fluid flow through thevalve 56 (and possibly regulated by the pressure regulator) enters thegas cooling device 24 here being an illustrative gas expansion orifice52. In particular, the compressed fluid passes through nozzle ororifice, and as the compressed fluid so passes the pressure drops andgas expands. The simultaneous expansion and pressure drop causes acorresponding drop in temperature. Thus the compressed fluid is cooledby the expansion orifice to create a chilled gas stream, which chilledgas is directed upon the heat generating components by either directlypositioning of the gas expansion orifice 52, or by way of a duct system.

In embodiments using a gas expansion orifice 52, the compressed fluidmay be any fluid that experiences appreciable cooling when expandedthrough an orifice. In some embodiments, the compressed fluid may betetraflourethane, which may be the primary ingredient in “canned air”used to clean computer components such as keyboards. In alternativeembodiments, the compressed fluid may be air, carbon dioxide ornitrogen. The gas expansion orifice may be placed within the enclosure14 (FIG. 1) of the computer system 100, or outside the enclosure 14 withthe chilled gas directed to the heat generating components by way of aduct system.

In alternative embodiments, the gas expansion orifice 52 may be integralwith the canister, and indeed flow of the compressed fluid out of thecanister to the attached, lower-pressure tubing (with or without anpressure regulator) may be a sufficient expansion “orifice” to generateddesired cooling, particularly in the case of tetraflouroethane as thecompressed fluid.

FIG. 4 illustrates a method in accordance with at least someembodiments. In particular, the method starts (block 400) and proceedsto operating a heat generating component of a computer system (block404). The heat generating component may take many forms. In someembodiments, the heat generating component is a main processor of thecomputer system (e.g., the processor coupled to a heat sink). In otherembodiments, the processor is a graphics processor on a graphics card.

Regardless of the precise nature of the heat generating component, thetemperature of the heat generating component is monitored (block 408).In some embodiments, the user monitors the temperature, such as byobserving a front-panel temperature display or monitoring a temperaturedisplayed graphically on a monitor of the computer system. In otherembodiments, the user may be unaware of the monitored temperature, andrather software executing on a processor of the computer system istasked with monitoring the temperature of the heat generating component.When the monitored temperature reaches a predetermined threshold, aburst of chilled gas is applied directly or indirectly to the heatgenerating component (block 412) and the process ends (block 416). Theburst of chilled gas aids in cooling the heat generating element.

What is claimed is:
 1. A cooling system for a computer comprising: acanister that holds a compressed fluid; a gas cooling device having aninlet port and a chilled gas outlet port; a valve that couples betweenthe canister and the inlet port of the gas cooling device, the valveselectively couples the compressed fluid to the inlet port; a pressureregulator that couples between the canister and the inlet port of thegas cooling device, wherein the pressure regulator selectively regulatesthe flow rate of gas to the inlet port of the gas cooling device; and achilled gas duct system that couples to the chilled gas outlet port, thechilled duct system configured to direct the chilled gas to be incidentupon at least one heat generating element of the computer system.
 2. Thecooling system as defined in claim 1 wherein the gas cooling device is avortex cooler.
 3. The cooling system as defined in claim 2 furthercomprising a hot gas duct system configured to direct hot gas to alocation external of a case of the computer system.
 4. The coolingsystem as defined in claim 1 wherein the gas cooling device is anexpansion orifice.
 5. The cooling system as defined in claim 4 whereinthe expansion orifice is integral with the canister.
 6. The coolingsystem as defined in claim 1 wherein the valve is a solenoid operatedvalve.
 7. A method comprising: operating a processor of a computersystem; monitoring a temperature of the processor; applying a burst ofchilled gas to a heat transfer element thermally coupled to theprocessor if the temperature of the processor reaches a predeterminedthreshold; supplying compressed fluid to a gas cooling device; directingchilled gas from the gas cooling device on the heat transfer element;and selectively regulating a flow rate of the compressed fluid to thegas cooling device with a pressure regulator.
 8. The method as definedin claim 7 wherein applying further comprises: supplying compressedfluid to a vortex cooler; directing chilled gas from the vortex cooleron the heat transfer element; and directing hot gas from the vortexcooler outside an outer enclosure of the computer system.
 9. The methodas defined in claim 7 wherein applying further comprises: supplyingcompressed fluid to a gas expansion orifice; and directing chilled gasfrom the gas expansion orifice on the heat transfer element.
 10. Acomputer system comprising: a means for enclosing computer systemcomponents; a means for executing instructions and generating heat, themeans for executing instructions coupled within the means for enclosing;a means for containing a compressed fluid, the means for containingcoupled to the means for enclosing; a means for producing chilled gasselectively fluidly coupled to the means for containing; and a pressureregulator for selectively regulating a flow rotate of the chilled gasfrom the means for containing to the means for producing chilled gas;wherein the chilled gas produced cools the means for executinginstructions.
 11. The computer system as defined in claim 10 wherein themeans for containing couples to an exterior surface of the means forenclosing.
 12. The computer system as defined in claim 10 furthercomprising: a means for sensing temperature of the means for executing;wherein a signal to fluidly couple the means for containing to the meansfor producing chilled gas is generated when a temperature sensed by themeans for sensing temperature reaches a predetermined threshold.
 13. Thecomputer system as defined in claim 10 further comprising a means totrigger coupling of the means for containing to the means for producingchilled gas.